Ukusetyenziswa kwe-Ultra-Thin Grinding:Ukugaya i-Ultra-Thin okanye i-back-thinning yezinto eziphambili, ezifana ne-SiC, i-GaAs, i-Sapphire, i-Si, i-GaN, i-InP.
Usetyenziso lweSemiconductor Wafer Grinder:Semiconductor wafer wafer ukucola okanye ukucolwa ngasemva kwemathiriyeli ephucukileyo, enje: SiC, GaAs, Sapphire, Si, GaN, InP.⢠Amalungu optical achanekileyo, anje¼ULE glass, High. -i-particle scintillator yamandla, ifilimu yeFluorescent, iglasi yeProjekthi.
I-Wafer grinder ye-resin imathiriyeli ifaneleke kakhulu kwiimveliso ezinobulukhuni obuphezulu, ubukhulu obuncinci kunye neqondo eliphezulu lokuchaneka ngokuchaneka kunye nomgangatho womphezulu. Uyilo oludityanisiweyo olunolawulo oluphezulu kunye nokubekwa kweliso kwenkqubo kwenza lo matshini ulungele ukusetyenziswa kuphando nophuhliso okanye ukuveliswa komthamo ophantsi wamacandelo aphambili.
I-Wafer Grinder I-Ceramic substrate ifaneleke kakhulu kwiimveliso ezinobunzima obuphezulu, ubukhulu be-ultra-thin kunye neqondo eliphezulu lokuchaneka kwi-flatness kunye nomgangatho womphezulu. Uyilo oludityanisiweyo olunolawulo oluphezulu kunye nokubekwa kweliso kwenkqubo kwenza lo matshini ulungele ukusetyenziswa kuphando nophuhliso okanye ukuveliswa komthamo ophantsi wamacandelo aphambili.
Ukusetyenziswa kwamavili okusila kwi-wafer: Ukusila ngokucokisekileyo kunye nokucokisekileyo kwezixhobo ezidityanisiweyo, izixhobo ezidityanisiweyo ze-silicon, ii-sapphire epitaxial wafers, ii-silicon wafers, i-GaAs, i-GaN, i-Silicon carbide, i-lithium tantalate, njl.
Oomatshini bokusila abathe nkqo abathe nkqo banokusila izixhobo zesemiconductor yesizukulwana sesithathu njengeSiC, GaN, GaAs, Si, ZnO. Uchungechunge lwe-DL-GSD ngumatshini wokusila owenziwe ngokwakho e-China, kwaye ukusebenza kwawo kuye kwafikelela kumgangatho wehlabathi.