IsiXhosa IsiXhosa
Restore
Ikhaya > Iimveliso > I-Wafer Grinder > Umatshini wokuSila iSemi-Automatic Wafer > Ultra-Thin Grinding
Ultra-Thin Grinding

Ultra-Thin Grinding

Ukusetyenziswa kwe-Ultra-Thin Grinding:Ukugaya i-Ultra-Thin okanye i-back-thinning yezinto eziphambili, ezifana ne-SiC, i-GaAs, i-Sapphire, i-Si, i-GaN, i-InP.Amagama aphambili:Ukwinqanaba Eliphambili, Abavelisi, Ifektri, Eyenziwe ngokwezifiso, eSitokhweni, kwiKowuti, ukuchaneka okuphezulu, ekulula ukugcina

Thumela ubuzo

Ingcaciso yeMveliso

1. IUsetyenziso lweTheUltra-Thin Grinding:


• Semiconductor wafer ukucolaokanye ukucuthwa ngasemva kwemathiriyeli ephezulu, efana nale:

SiC, GaAs, Sapphire, Si, GaN, InP.
⢠Izinto zamehlo ezichaneke kakhulu, ezifana no-ï¼
Iglasi ye-ULE, i-High-energy particle scintillator, ifilimu yeFluorescent, iglasi yeProjekthi.


⢠Isiseko se-Ceramic, esifana ne-¼

Al2O3, AlN, CaF2, ZnSe, carbide, ZrOâ, BaTiO3, SrTiO3, PbTiO3, LiNbO3, CdTe, CdS, Ca2Sx, Al2O3CrNd, njl.


⢠ukupakishwa kwe-semiconductor ephucukileyo, enje:

ceramic, polyimide, Resin izinto.




2. Ukusetyenziswa kweUltra-Thin Grinding:


Ultra-Thin Grindingingasetyenziselwa ukubhitya ngokukhawuleza imveliso, ukuphucula umgangatho womphezulu wemveliso, kunye nokunyusa umcaba kunye nokuhambelana, kwaye inokulawula ngokufanelekileyo ubuninzi, inokufikelela ukunyamezela okuphezulu.


Ukwakhiwa kwezixhobo zeUltra-Thin Grinding:

I-vacuum suction cup, i-Spindle, i-Drive mechanism, ivili lokusila, indlela yokutya, inkqubo yokulawula i-loop evaliweyo ngokupheleleyo, njl.


3. Indlela yokulawula:


1). Lo matshini uthatha i-PLC ye-brand eyaziwayo yamazwe ngamazwe kunye nesikrini sokuchukumisa, esinezinga eliphezulu lokuzenzekelayo, liqonda ujongano lomatshini womntu, kwaye ukusebenza kulula kwaye kucacile ngokujonga nje.
2).Inzwa yokufumanisa uxinzelelo lomoya, xa uxinzelelo lomoya luphantsi kunobuncinci boxinzelelo olubekwe sisixhobo sokulungiswa okuqhelekileyo, izixhobo ziya kuba ne-alamu ukukhusela i-workpiece ukuba ifunxe ngokuqinileyo.
3).Ukulawula i-torque yevili lokugaya, xa i-torque iphezulu kune-torque eveliswa yinkqubo eqhelekileyo esetyenzisiweyo yisixhobo, izixhobo ziya kuba yi-alarm ukukhusela iinxalenye zoomatshini ukuba zingonakaliswe sisixhobo xa izixhobo zingaqhelekanga okanye zingasebenzi kakuhle.
4).Ivili lokugaya iliso langoku, xa ivili lokugaya elibandayo liphezulu kunobuninzi bangoku obuveliswa yinkqubo eqhelekileyo esetyenzisiweyo sisixhobo, ivili lokusila i-rebounds, kunye nomgama ojikelezayo unokuhlengahlengiswa ukukhusela ivili lokusila ukuba licinezele i-workpiece kwaye ibangele. umonakalo.
5).Imbuyekezo ezenzekelayo yokunxiba kwevili lokugaya ikhusela ukusetyenziswa kwevili lokugaya ngelixa ukugaya imveliso ekuchaphazela ukuchaneka kokulungiswa komsebenzi.


4. Izinto ozikhethelayo ezongezelelweyoï¼


1).Ivili lokusila ngokuzenzekelayo ukunxiba kwi-intanethi
2).Inkqubo yokulinganisa ubukhulu be-Intanethi
ï¼Sazisoï¼Ukuba ufuna ukufakela ezi zinto zimbini zingasentla, nceda ubeke phambili phambi kokuthenga isixhobo.ï¼

5. Izinto eziluncedo kwiUltra-Thin Grinding


Ubukhulu be-4/6 ye-intshi ye-silicone ye-intshi ingancitshiswa ibe yi-80um ubukhulu ngaphandle kokuphuka.

6. IParameter yobuGcisa yeUltra-Thin Grinding：


Umzekelo

I-TY-GD6

I-TY-GD12

I-TY-GD22

Ubukhulu bobungakanani bomsebenzi

Φ150

Φ300

Φ550

Isantya sevili

0-3000rpm/min

0-3000rpm/min

0-3000rpm/min

Ivili motor amandla

5.5kw

5.5kw

5.5kw

Isantya sokufunxa

0-300rpm/min

0-300rpm/min

0-300rpm/min

Amandla okufunxa

1.5KW  220V

1.5KW  220V

1.5KW  220V

Inkqubo yokulawula igrayiti

Isigqibo： 0.001mm

Isigqibo： 0.001mm

Isigqibo： 0.001mm

Ukucaba

3um(4 intshi)

3um(4 intshi)

3um(4 intshi)

Ukufana

3um(4 intshi)

3um(4 intshi)

3um(4 intshi)

Ukunyamezela ukutyeba

2um(4 intshi)

2um(4 intshi)

2um(4 intshi)

Ubuncinci obukhulu

≤100um

≤100um

≤100um

Ubuncinci bokumisela inyathelo levili lokusila

0.1um/s

0.1um/s

0.1um/s

Ubungakanani betanki yamanzi

780*480*550mm

780*480*550mm

780*480*550mm

Ubungakanani besixhobo

1010*1210*2070mm

1010*1210*2070mm

1010*1210*2070mm

ubunzima

1200KG

1200KG

1200KG


7.Umzi-mveliso waseShenzhen Tengyu Grinding Technology Co., Ltd.







I-Shenzhen Tengyu Grinding Technology Co., Ltd. yayikwiSithili esitsha sase-Guangming, e-Shenzhen, e-China, kunye nenkunzi ebhalisiweyo ye-5 yezigidi ze-yuan, indawo yezityalo malunga ne-13,000 yeemitha ze-square. Lishishini elibandakanyeka kubuchwephesha bokusila kunye nokupholisha. Inkampani igxile kwi-R&D, imveliso kunye nokuthengiswa kwezixhobo zokusila ezichanekileyo eziphezulu, izixhobo zokuthambisa ezisicaba, izixhobo zokuthambisa ezikhawulezayo, izixhobo zokupolisha ze-3D kunye nezinto zayo ezixhasayo. Iimveliso zayo zisetyenziswa ngokubanzi ekusetyenzweni ngokuchanekileyo kwezitywina zoomatshini, unxibelelwano lwe-elektroniki, i-ceramics, i-semiconductors, i-crystals optical, i-aerospace, i-automold mold, i-LED, izixhobo zefowuni eziphathwayo, i-hardware kunye nezinye izinto. Isiseko sabathengi sisasazwa kulo lonke ilizwe nakwamanye amazwe, kwaye abameli bayo baquka iTF, MEEYA, Tongda Group, Hanslaser, kunye nezinye iinkampani ezininzi ezaziwayo.


8. FAQ

I-Q1: Ngaba uyinkampani yokurhweba okanye umenzi?
A: Singumenzi. Sinomzi-mveliso wethu kunye namagcisa anamava.

Q2: Ithini imiqathango yakho yokuhlawula?
A: T / T 30% njengediphozithi, kunye ne-70% ngaphambi kokunikezelwa. Siza kukubonisa iifoto zeemveliso kunye neepakethi phambi kokuba uhlawule imali eseleyo.

I-Q3: Ithini imimiselo yakho yokuhambisa kunye nexesha lokuhambisa?
A: I-EXW, i-FOB, i-CFR, i-CIF, i-DDU, njl. Ngokuqhelekileyo, kuya kuthatha i-7 kwiintsuku ze-20 emva kokufumana intlawulo yakho yangaphambili.Ixesha elithile lokuhambisa lixhomekeke kwizinto kunye nobuninzi be-oda yakho.

I-Q4: Ngaba unokubonelela ngenkxaso yetekhnoloji?
A: Sikule ntsimi iminyaka engaphezu kwama-20. Ukuba kukho nayiphi na ingxaki, nceda uqhagamshelane nathi, siya kubonelela ngeengcebiso kwinjineli yethu ukukunceda ukusombulula ingxaki.

I-Q5: Yintoni i-MOQ yeemveliso ezenziwe ngokwezifiso?
A: Singabavelisi kwaye sinokukunika i-MOQ encinci yeemveliso ezenziwe ngokwezifiso.

I-Q6: Ngaba uyazivavanya zonke iimpahla zakho ngaphambi kokuhanjiswa?
A: Ewe, zonke iimveliso ziya kuvavanywa phambi kokuhanjiswa.

I-Q7: Ulenza njani ishishini lethu ixesha elide kunye nobudlelwane obuhle?
IMPENDULO:Sigcina umgangatho olungileyo kunye nexabiso elikhuphisanayo ukuqinisekisa ukuba abathengi bethu bayaxhamla, kwaye siyabahlonipha bonke abathengi njengomhlobo wethu kwaye siqhuba ishishini ngokunyanisekileyo kwaye senza ubuhlobo nabo, nokuba basuka phi.

I-Q8: Ngaba kukho isiqinisekiso somgangatho?
A: Sinikeza unyaka omnye isiqinisekiso somgangatho. Sinoxanduva lomgangatho wezitywina zethu zoomatshini.

Udidi oluhambelana

Umatshini wokuSila weWafer oZimamelayo ngokupheleleyo

Umatshini wokuSila iSemi-Automatic Wafer

Umatshini wokuSila oxwesileyo

Send Inquiry

Nceda uzive ukhululekile ukunika umbuzo ngale fomu ingezantsi. Siza kukuphendula kwiiyure ezingama-24.
验证码,看不清楚?请点击刷新验证码
+86-13622378685
grace@lapping-machine.com