grace@lapping-machine.com
+86-13622378685

Iimveliso ezintsha

Zonke iimveliso ezintsha

Umatshini wokuSila iSemi-Automatic Wafer

IsiXhobo soLungiselelo lweWafer
Usetyenziso lweSixhobo sokuLungisa i-Wafer: i-wafer ye-semiconductor yokusila okanye ukucolwa ngasemva kwezinto eziphambili, ezinje: SiC, GaAs, Sapphire, Si, GaN, InP.
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Ultra-Thin Grinding
Ukusetyenziswa kwe-Ultra-Thin Grinding:Ukugaya i-Ultra-Thin okanye i-back-thinning yezinto eziphambili, ezifana ne-SiC, i-GaAs, i-Sapphire, i-Si, i-GaN, i-InP.
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Semiconductor Wafer Grinder
Usetyenziso lweSemiconductor Wafer Grinder:Semiconductor wafer wafer ukucola okanye ukucolwa ngasemva kwemathiriyeli ephucukileyo, enje: SiC, GaAs, Sapphire, Si, GaN, InP.â¢ Amalungu optical achanekileyo, anje¼ULE glass, High. -i-particle scintillator yamandla, ifilimu yeFluorescent, iglasi yeProjekthi.
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+86-13622378685

grace@lapping-machine.com