Umatshini weSilicon Carbide Wafer Thinning usetyenziswa ikakhulu ekunciphiseni izixhobo zesubstrate ezifana nesilicon wafer, gallium arsenide, silicon carbide ceramics, zirconia ceramics, graphite, lithium tantalate njalo njalo.
Oomatshini bokusila abathe nkqo abathe nkqo banokusila izixhobo zesemiconductor yesizukulwana sesithathu njengeSiC, GaN, GaAs, Si, ZnO. Uchungechunge lwe-DL-GSD ngumatshini wokusila owenziwe ngokwakho e-China, kwaye ukusebenza kwawo kuye kwafikelela kumgangatho wehlabathi.