I-Wafer & semiconductor polishing slurry yi-colloidal silica slurry ephuhliswe ngokukodwa ukugudisa iiseramikhi, kunye ne-electronic substrates ezifana ne-lithium tantalate (LiTaO3), lithium niobate (LiNbO3), kunye ne'Glass Photomask, Ferrite Ceramics, Ni-P Disk, Crystal, PZT Ceramics. , iBarium Titanate Ceramics, iSilicon engenanto, iAlumina Ceramics, iCaF2, iBare Silicon Wafer Rework, iiCeramics zeSiC, iSapphire, iiSubstrates zeElectronic, iiCeramics, iCrystal. Ngokufana okugqwesileyo kwamasuntswana kunye nokusabalalisa, ihambisa izinga eliphezulu lokususa kunye nokupolisha okungenamonakalo.
Olu ludaka olukhazimlayo oluvelisa ukugqibezela kwesipili kuzo zonke iintlobo zesinyithi ezifana ne-aluminiyam, intsimbi engatyiwa, kunye ne-titanium.
Lo ngumgubo weCerium oxide wokupolisha, amandla okupholisha eglasi asetyenziselwa ukupolisha ngesantya esiphezulu, esinje: iglasi yefowuni ephathwayo, iilensi ezichanekileyo, iilensi zamehlo, izikrini zeLCD, njl.
Oomatshini abaLapha baMacala aBabini banokusila ii-silicone wafers, iglasi ebonakalayo, iialloyi ze-aluminiyam, iialloyi ze-titanium, intsimbi ye-tungsten, intsimbi engatyiwa kunye nezinye izinto kumacala omabini ngokuchaneka okuphezulu.
Ipolishi yecala elinye isetyenziswa kakhulu ekusileni icala elinye kunye nokupolishwa kweeseramikhi zealumina, iZirconia (PSZ) iiCeramicsï¼SiC zeCeramics, ii-Optical Glass Wafers, iiWafers zeQuartz, iiSilicon Wafers, ii-wafers ze-Germanium, iringi yokutywina, intsimbi engatyiwa, i-Cemented Alloy. Carbide, Tungsten Steel njl.
Usetyenziso lweSixhobo sokuLungisa i-Wafer: i-wafer ye-semiconductor yokusila okanye ukucolwa ngasemva kwezinto eziphambili, ezinje: SiC, GaAs, Sapphire, Si, GaN, InP.