Oomatshini bokubopha icala elinye basetyenziselwa ukugawula icala elinye kunye nokupolisha kwesapphire substrates ze-LED, iOptical Glass Wafers, Quartz Wafers, Silicon Wafers, Germanium wafers, Light Guide Plates, Optical Cutting Valve Sheets, Hydraulic Compaction, Stainless Steel, Titanium Alloy. , Cemented Carbide, Tungsten Steel kunye nezinye izinto.
I-Flat Grinding Machine isetyenziselwa ngokubanzi ukugaya icala elinye kunye nokupolisha kwe-Seal ring, i-ceramic seal, insimbi engenasici, insimbi ye-tungsten, i-alloy blade, i-razor blade, i-silicon wafer, i-lithium carbonate, i-lithium niobate kunye nezinye izinto ze-crystal kunye nezixhobo zetsimbi.
I-Polyurethane pad yokupholisha ikwabizwa ngokuba yi-cerium oxide pad yokupholisha, i-microdermabrasion ebomvu, i-metallographic yesikhumba sokupholisha, njl njl. Isetyenziswa ikakhulu kwisibuko sokugulisa ikristale, imisebenzi yezandla yeglasi, amatye anqabileyo kunye nekristale optics.
I-Disc yokusila idayimani inokusila ngokufanelekileyo isafire, i-silicon carbide, intsimbi ye-tungsten, i-carbide enesamente, i-superalloy kunye nezinye izinto.
Ukugaya kunye nokupolisha ziinkqubo ezimbini ezisetyenziselwa ukuphucula ukunyanzeliswa kunye noburhabaxa bomphezulu we-workpiece. Kweyona nkqubo yokufaka isicelo, siqhele ukusebenzisa iipleyiti ezahlukeneyo ukufezekisa oku, kodwa apha ndizakwazisa ipleyiti yokugaya ekhethekileyo, enokuphunyezwa ukuSila nokupholisha ngaxeshanye.
Ngawaphi amacandelo aphambili epleyiti eLapping? Yenziwe ngomxube we-homogeneous we-synthetic resins, umgubo wesinyithi kunye nokudibanisa okungundoqo / ukuqina. Yintoni umsebenzi we-Lapping plate? Ipleyiti yokuqhotsa yenza kube lula ukucola kunye nokuphucula ukucaba kunye noburhabaxa bomphezulu womsebenzi.