I-Wafer grinder yahlulwe yaba ziindidi ezimbini: i-semi-automatic kunye ne-automatic ngokupheleleyo. Phakathi kwazo, kukho iimodeli ezininzi ze-semi-automatic, kubandakanywa imodeli esisiseko, imodeli ye-spindle ejikelezayo emoyeni, iimodeli ze-axis ezimbini, kunye neemodeli ze-axis enye, nganye inemisebenzi eyahlukeneyo kunye nokuchaneka. Ukuba uyayifuna, nceda uqhagamshelane nenkonzo yethu yabathengi ngokweenkcukacha ukuze uqinisekise eyona modeli ifanelekileyo kuwe.
Igrinder ye-wafer eveliswe nguTengyu ibekwe kwimarike iminyaka emininzi. Ngenxa yokusetyenziswa kwayo okubanzi, iimveliso ezibhityisiweyo zichanekile, ubomi benkonzo ende kunye nesantya esisezantsi sokungaphumeleli, kwaye ziphumelele indumiso ngamxhelo mnye kubathengi.
Oomatshini bokusila abathe nkqo abathe nkqo banokusila izixhobo zesemiconductor yesizukulwana sesithathu njengeSiC, GaN, GaAs, Si, ZnO. Uchungechunge lwe-DL-GSD ngumatshini wokusila owenziwe ngokwakho e-China, kwaye ukusebenza kwawo kuye kwafikelela kumgangatho wehlabathi.